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Modeling and Evaluation of Application-Aware Dynamic Thermal Control in HPC Nodes25th IFIP/IEEE International Conference on Very Large Scale Integration - System on a Chip (VLSI-SoC), Oct 2017, Abu Dhabi, United Arab Emirates. pp.198-219, ⟨10.1007/978-3-030-15663-3_10⟩
Conference papers
hal-02319789v1
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