Approach for the 3D-Alignment in Micro- and Nano-scale Assembly Processes
Abstract
Most assembly processes on the nano-scale take place
in a Scanning Electron Microscope (SEM) for the reason of high
magnification range of the microscope itself. Like all microscopes, the
SEM delivers visual data just in two dimensions. This is a bottleneck
for all assembly processes which require of course information of the
parts to join in a third dimension. This paper shows an approach with a
dedicated sensor. As an example for an assembly process a carbon nano
tube (CNT) is fixed on a sharp metal tip. The sensor used detects
contact between these two parts by exciting a bimorph cantilever made
from piezoelectric material. It is shown that with this approach the
contact is reliably detected. Recent experiments on introducing a new
excitation structure show the possibility to add more dimensional
testing in the same way as the one dimensional type.
Domains
Digital Libraries [cs.DL]Origin | Files produced by the author(s) |
---|
Loading...