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authFullName_s : U. Staufer
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Design, Fabrication and Testing of Assembly Features for Enabling Sub-micron Accurate Passive Alignment of Photonic Chips on a Silicon Optical Bench

J. Van Gurp , Marcel Tichem , U. Staufer
6th International Precision Assembly Seminar (IPAS), Feb 2012, Chamonix, France. pp.17-27, ⟨10.1007/978-3-642-28163-1_3⟩
Conference papers hal-01363875v1
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A Haptic Tele-operated System for Microassembly

P. Estevez , S. Khan , P. Lambert , M. Porta , I. Polat , et al.
5th IFIP WG 5.5 International Precision Assembly Seminar (IPAS), Feb 2010, Chamonix, France. pp.13-20, ⟨10.1007/978-3-642-11598-1_2⟩
Conference papers hal-01055677v1