@inproceedings{thiele:hal-02319795,
  TITLE = {{Electromigration Analysis of VLSI Circuits Using the Finite Element Method}},
  AUTHOR = {Thiele, Matthias and Bigalke, Steve and Lienig, Jens},
  URL = {https://inria.hal.science/hal-02319795},
  BOOKTITLE = {{25th IFIP/IEEE International Conference on Very Large Scale Integration - System on a Chip (VLSI-SoC)}},
  ADDRESS = {Abu Dhabi, United Arab Emirates},
  EDITOR = {Michail Maniatakos and Ibrahim (Abe) M. Elfadel and Matteo Sonza Reorda and H. Fatih Ugurdag and Jos{\'e} Monteiro and Ricardo Reis},
  PUBLISHER = {{Springer International Publishing}},
  SERIES = {VLSI-SoC: Opportunities and Challenges Beyond the Internet of Things},
  VOLUME = {AICT-500},
  PAGES = {133-152},
  YEAR = {2017},
  MONTH = Oct,
  DOI = {10.1007/978-3-030-15663-3\_7},
  KEYWORDS = {FEM ; Electromigration ; Interconnect ; Reliability ; Physical verification ; Routing},
  PDF = {https://inria.hal.science/hal-02319795/file/479099_1_En_7_Chapter.pdf},
  HAL_ID = {hal-02319795},
  HAL_VERSION = {v1},
}