%0 Conference Proceedings
%T Constructing a Metrology Sampling Framework for In-line Inspection in Semiconductor Fabrication
%+ Department of Industrial Engineering and Engineering Management [Hsinchu]
%A Chien, Chen-Fu
%A Lin, Yun-Siang
%A Tan, Yu-Shin
%Z Part 2: Service Engineering Based on Smart Manufacturing Capabilities
%< avec comité de lecture
%( IFIP Advances in Information and Communication Technology
%B IFIP International Conference on Advances in Production Management Systems (APMS)
%C Seoul, South Korea
%Y Ilkyeong Moon
%Y Gyu M. Lee
%Y Jinwoo Park
%Y Dimitris Kiritsis
%Y Gregor von Cieminski
%I Springer International Publishing
%3 Advances in Production Management Systems. Smart Manufacturing for Industry 4.0
%V AICT-536
%N Part II
%P 73-80
%8 2018-08-26
%D 2018
%R 10.1007/978-3-319-99707-0_10
%K Bayesian decision analysis
%K Sampling frequency
%K WIP metrology
%K Inspection
%K Quality control
%K Equipment efficiency
%Z Computer Science [cs]Conference papers
%X Due to the shrinking IC device geometries and increasing interconnect layers, process complexity has been rapidly increasing and leads to higher manufacturing costs and longer cycle time. Thus, in-line metrology is set at various steps to inspect the wafer in real time, which often causes lots of inspection costs and also increases cycle time. This study aims to develop a framework for in-line metrology sampling to determine the optimal sampling strategy in the light of different objectives to reduce extra cost and cycle time.
%G English
%Z TC 5
%Z WG 5.7
%2 https://inria.hal.science/hal-02177870/document
%2 https://inria.hal.science/hal-02177870/file/472851_1_En_10_Chapter.pdf
%L hal-02177870
%U https://inria.hal.science/hal-02177870
%~ IFIP
%~ IFIP-AICT
%~ IFIP-TC
%~ IFIP-TC5
%~ IFIP-WG
%~ IFIP-APMS
%~ IFIP-WG5-7
%~ IFIP-AICT-536