%0 Conference Proceedings
%T Communication Locality Analysis of Triplet-Based Hierarchical Interconnection Network in Chip Multiprocessor
%+ Beijing Institute of Technology (BIT)
%+ Mehran University of Engineering & Technology
%A Talpur, Shahnawaz
%A Shi, Feng
%A Wang, Yizhuo
%Z Part 1: Algorithms, Scheduling, Analysis, and Data Mining
%< avec comité de lecture
%( Lecture Notes in Computer Science
%B 9th International Conference on Network and Parallel Computing (NPC)
%C Gwangju, South Korea
%Y James J. Park
%Y Albert Zomaya
%Y Sang-Soo Yeo
%Y Sartaj Sahni
%I Springer
%3 Network and Parallel Computing
%V LNCS-7513
%P 33-41
%8 2012-09-06
%D 2012
%R 10.1007/978-3-642-35606-3_4
%K Chip multiprocessor
%K communication locality
%K interconnection network
%K mesh
%Z Computer Science [cs]Conference papers
%X Interconnection topology inside chip multiprocessor acts as fundamental role in communication locality. Considering compiler optimization data locality has been an inmost hypothesis in the high performance computing. Conversely, data locality sphere has several troubles when its degree of dimension is two or higher. In mesh network of two dimensions, each core is connected with its four neighbors. The data locality can potentially be exploited in two dimensions considering the specified processor’s perspective. A Triplet-Based Hierarchical Interconnection Network (TBHIN) has straightforward topology and fractal attribute for chip multiprocessor. In this paper, a static (no contention) performance analysis of TBHIN and 2-D mesh is presented, based on the premise of locality in communication. The dynamic (contention) software simulation of TBHIN shows that the stronger the locality in communication, the lower the delay of the communication.
%G English
%Z TC 10
%Z WG 10.3
%2 https://inria.hal.science/hal-01551366/document
%2 https://inria.hal.science/hal-01551366/file/978-3-642-35606-3_4_Chapter.pdf
%L hal-01551366
%U https://inria.hal.science/hal-01551366
%~ IFIP-LNCS
%~ IFIP
%~ IFIP-AICT
%~ IFIP-TC
%~ IFIP-TC10
%~ IFIP-NPC
%~ IFIP-WG10-3
%~ IFIP-LNCS-7513