@inproceedings{szyperski:hal-01444485,
  TITLE = {{A Novel Phase-Based Approach to Tear Film Surface Quality Assessment Using Lateral Shearing Interferometry}},
  AUTHOR = {Szyperski, Piotr and Iskander, D. Robert},
  URL = {https://inria.hal.science/hal-01444485},
  NOTE = {Part 6: Pattern Recognition and Image Processing},
  BOOKTITLE = {{14th Computer Information Systems and Industrial Management (CISIM)}},
  ADDRESS = {Warsaw, Poland},
  EDITOR = {Khalid Saeed and Wladyslaw Homenda},
  PUBLISHER = {{Springer}},
  SERIES = {Computer Information Systems and Industrial Management},
  VOLUME = {LNCS-9339},
  PAGES = {435-447},
  YEAR = {2015},
  MONTH = Sep,
  DOI = {10.1007/978-3-319-24369-6\_36},
  KEYWORDS = {in-vivo interferometry ; Takeda's algorithm ; two dimensional phase unwrapping ; Goldstein's algorithm},
  PDF = {https://inria.hal.science/hal-01444485/file/978-3-319-24369-6_36_Chapter.pdf},
  HAL_ID = {hal-01444485},
  HAL_VERSION = {v1},
}