@inproceedings{taprogge:hal-01363876,
  TITLE = {{Parallel Packaging of Micro Electro Mechanical Systems (MEMS) Using Self-alignment}},
  AUTHOR = {Taprogge, Jens and Beyeler, Felix and Steinecker, Alexander and Nelson, Bradley J.},
  URL = {https://inria.hal.science/hal-01363876},
  NOTE = {Part 1: Micro Assembly Processes and Systems},
  BOOKTITLE = {{6th International Precision Assembly Seminar (IPAS)}},
  ADDRESS = {Chamonix, France},
  EDITOR = {Svetan Ratchev},
  PUBLISHER = {{Springer}},
  SERIES = {Precision Assembly Technologies and Systems},
  VOLUME = {AICT-371},
  PAGES = {28-35},
  YEAR = {2012},
  MONTH = Feb,
  DOI = {10.1007/978-3-642-28163-1\_4},
  KEYWORDS = {flip-chip ; C-4 ; self-alignment ; MEMS ; MOEMS ; no clean ; force sensor ; solder paste ; bismuth ; FemtoTools ; wafer level packaging ; WLP ; chip scale packaging ; CSP ; direct chip attach ; DCA ; DRIE ; SOI},
  PDF = {https://inria.hal.science/hal-01363876/file/978-3-642-28163-1_4_Chapter.pdf},
  HAL_ID = {hal-01363876},
  HAL_VERSION = {v1},
}