Numerical Simulation of Temperature Field in Selective Laser Sintering
Abstract
The laser sintering process of multi-component powder W/Cu is simulated by ANSYS software based on the factors of radiation, convection and thermal physical parameters on temperature. The laser power and scanning velocity which are the key process parameters to affect directly in sintering molding are studied in paper. The results show that when the scanning velocity is constant, the sintering depth is rising with the increase of laser power; In addition, when the laser power is constant, the sintering depth is decreasing with the increase of scanning velocity. To select reasonable processing parameters and meet the requirements of sintering quality on the sintering depth, the parameters of laser power and scanning velocity are optimized by analyzing the sintering depth.
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